Arctic Silver 5 Premium High-Density Thermal Compound – 99.9% Pure Silver for Superior Heat Transfer

£6.45£6.45 Excl. VATIncl. VAT

Thermal Conductivity: >8.9 W/m°K
Composition: Over 88% thermally conductive filler by weight, including 99.9% pure silver, zinc oxide, aluminum oxide, and boron nitride
Electrical Conductivity: None – electrically non-conductive
Operating Temperature Range: -50°C to >130°C (long-term); up to 180°C
Recommended Application: Between high-performance CPUs/GPUs and heatsinks or water cooling solutions

Discount per Quantity

QuantityDiscountPrice
33%£6.26£6.26
57%£6.00£6.00
1017%£5.35£5.35
5024%£4.90£4.90

Out of stock

Category:

Description

Arctic Silver 5 sets the benchmark for high-performance thermal compounds with its advanced blend of micronized pure silver and thermally optimized ceramic particles. Designed for efficient heat transfer between modern high-power CPUs and high-performance heatsinks or water-cooling systems, it delivers exceptional thermal conductivity and long-term reliability. Whether you’re overclocking, building a gaming PC, or just want the best for your hardware, Arctic Silver 5 offers unmatched stability and performance.

Features:

Ultra-Pure Silver Content: Formulated with 99.9% pure silver in three particle shapes for maximum thermal transfer.

High Thermal Density: Composed of over 88% thermally conductive material by weight for excellent heat dissipation.

Enhanced Ceramic Additives: Includes zinc oxide, aluminum oxide, and boron nitride for improved performance and durability.

Electrically Non-Conductive: Safe to use around electronic components, with no risk of short circuits.

Long-Term Stability: Engineered to resist bleeding, running, separation, or migration over time.

Optimized for Modern Hardware: Ideal for high-performance CPUs and GPUs with heatsinks or liquid cooling systems.

Reviews

There are no reviews yet.

Be the first to review “Arctic Silver 5 Premium High-Density Thermal Compound – 99.9% Pure Silver for Superior Heat Transfer”

Your email address will not be published. Required fields are marked *