Description
HY410 is a high-performance thermal paste compound engineered for superior heat transfer and efficient cooling in electronic components. With a thermal conductivity of 1.42W/m-k, this silicone-based grease is ideal for use with CPUs, GPUs, RAM modules, LED lights, and copper heat sinks.
Its ultra-low thermal resistance ensures excellent thermal contact between heat sources and heat sinks, helping maintain system stability and performance, especially under load.
Features:
Thermal Conductivity: 1.42W/m-k – Provides excellent heat dissipation
Dielectric Composition: Electrically non-conductive for safe usage
Versatile Use: Suitable for CPU/GPU, LED lighting, copper heat sinks, RAM, and more
Ultra Low Thermal Resistance: Ensures maximum heat transfer and cooling efficiency
Safe & Compliant: RoHS compliant – free from hazardous substances
Convenient Packaging: Supplied in a 10g syringe for easy and accurate application
Ideal for Reapplication: Can also be used as a secondary filler for previously pasted surfaces
Wide Temperature Range: Works effectively in low to moderately high-temperature environments









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